Bionic Embedded Wafer Handling Pad
The Bionic Embedded Wafer Handling Pad is designed for
secure semiconductor wafer and substrate handling in robotic transfer
and positioning systems.
Its biomimetic microstructured contact surface provides
high tangential friction with relatively low normal adhesion,
helping reduce wafer slip while supporting smooth release during transfer.
Unlike adhesive-backed pads, the embedded type is installed directly
into a machined mounting hole in the robot finger or end-effector.
Standard and anti-static material options are available
according to the required process environment.
High Friction and Low Adhesion
The microstructured surface is designed to increase lateral friction
between the wafer and the handling pad while maintaining relatively low
pull-off force in the normal direction.
This combination helps stabilize wafers during acceleration,
deceleration, alignment and positioning while reducing excessive
sticking when the wafer is released.
Embedded Mounting Design
The embedded pad is designed to fit into a prepared mounting hole
in the robot finger, wafer fork or handling fixture.
Correct mounting-hole dimensions and tolerances are important for
maintaining pad position, installation height and stable wafer contact.
The pad should be fully seated in the mounting hole before use.
Standard and Anti-Static Material Options
Both standard and anti-static embedded friction pads
are available.
For ESD-sensitive semiconductor processes, the anti-static version
can be selected while retaining the same embedded mounting concept
and microstructured friction surface.
| Material Option | Typical Volume Resistivity | Typical Application |
|---|---|---|
| Standard | Approx. 2.9 × 1014 Ω·cm | General wafer handling |
| Anti-Static | 106–109 Ω·cm | ESD-sensitive wafer handling |
Standard Embedded Pad Sizes
Several standard embedded pad dimensions are available.
Custom dimensions can also be supplied according to the mounting hole,
robot finger design and wafer handling requirements.
| Diameter | Thickness | Material Options |
|---|---|---|
| 5.3 mm | 1.0 mm | Standard / Anti-Static |
| 6.5 mm | 0.92 mm | Standard / Anti-Static |
| 7.6 mm | 1.8 mm | Standard / Anti-Static |
| 7.8 mm | 1.55 mm | Standard / Anti-Static |
| Custom | Custom | According to requirement |
Key Features
- High tangential friction for stable wafer handling
- Low normal adhesion for controlled wafer release
- Embedded mounting for robot fingers and wafer handling fixtures
- Standard and anti-static material options
- Low surface marking and residue
- Hydrophobic surface with water contact angle greater than 100°
- Suitable for semiconductor and display substrate handling
- Multiple standard sizes available
- Custom diameter, thickness and mounting geometry available
Typical Applications
The embedded bionic friction pad is suitable for wafer and substrate
handling equipment where a mechanically retained pad is preferred.
- Semiconductor wafer handling robots
- Robot fingers
- Wafer forks
- End effectors
- Atmospheric robots
- Vacuum robots
- Wafer aligners
- Substrate transfer equipment
- Display and glass substrate handling
Mounting Hole Requirements
The dimensions of the mounting hole should match the selected pad geometry.
Incorrect hole dimensions may result in pad movement, deformation,
incorrect installation height or pad damage.
For customized embedded pads, customers are encouraged to provide
a drawing of the robot finger or mounting hole for dimensional evaluation.
Custom Embedded Pad Solutions
In addition to standard sizes, custom embedded friction pads can be
developed according to different wafer handling equipment and
installation requirements.
- Custom pad diameter
- Custom pad thickness
- Custom stem and mounting geometry
- Custom installation height
- Standard or anti-static material
- Custom robot finger compatibility
- Custom mounting-hole dimensions
- Wafer or substrate size requirements
- Operating environment requirements
For evaluation and quotation, please provide the robot finger drawing,
mounting-hole dimensions, required pad size, wafer size,
operating environment and anti-static requirements.
Installation and Handling
- Clean the mounting area before installation.
- Confirm that the mounting hole matches the required pad dimensions.
- Do not force an oversized pad into the mounting hole.
- Make sure the pad is fully seated before wafer handling.
- Wear clean gloves during installation.
- Keep the microstructured contact surface free from contamination.
- Do not touch the contact surface with sharp tools.
Frequently Asked Questions
What is an embedded wafer handling pad?
It is a friction pad designed to be mechanically installed into a
prepared mounting hole in a robot finger, wafer fork or end-effector.
Is an anti-static embedded pad available?
Yes. Standard and anti-static material options are available.
Please specify whether ESD control is required when requesting a quotation.
What standard sizes are available?
Typical standard diameters include 5.3 mm, 6.5 mm, 7.6 mm and 7.8 mm,
with different thickness and mounting geometries.
Can the pad dimensions be customized?
Yes. Diameter, thickness, mounting geometry and installation height
can be customized according to the robot finger or mounting-hole design.
Why is mounting-hole tolerance important?
An oversized or undersized mounting hole may cause pad movement,
deformation, incorrect height or damage. The mounting dimensions
should therefore match the selected pad design.
Can I provide my robot finger drawing?
Yes. Providing the robot finger or mounting-hole drawing is recommended
for customized embedded pad evaluation.
