6 Inch Sapphire Wafer Specifications
The 6 Inch Sapphire Wafer is a 150 mm single-crystal
Al₂O₃ substrate available with multiple crystal orientations, surface finishes
and dimensional specifications.
In addition to standard C-plane sapphire wafers, Material-Semi supports
custom sapphire substrates with different crystal orientations, thicknesses,
off-axis angles, polishing configurations and edge specifications.
Available 6 Inch Sapphire Wafer Options
| Parameter | Available Options |
|---|---|
| Material | Single-Crystal Sapphire (Al₂O₃) |
| Diameter | 150 mm / Custom dimensions available upon request |
| Crystal Orientation | C-Plane (0001) / A-Plane / M-Plane / Custom Orientation |
| Off-Axis | On-axis or customized off-axis angle and direction |
| Thickness | Standard or customized thickness |
| Surface Finish | SSP / DSP / Epi-ready |
| Front Surface | Polished / CMP / Epi-ready |
| Back Surface | Polished / Lapped / Ground |
| Flat / Notch | Customizable according to orientation and application |
| Edge Profile | R-Type / Custom bevel profile |
| Packaging | Cassette / Single wafer container / Custom packaging |
Typical 6 Inch C-Plane Sapphire Wafer Specification
The following specification represents a typical 150 mm C-plane sapphire wafer.
Other orientations, thicknesses and surface configurations can be customized
according to customer requirements.
| Parameter | Typical Specification |
|---|---|
| Diameter | 150 mm ±0.2 mm |
| Orientation | C-Plane (0001) |
| Off-Axis | C-plane toward M-axis 0.2° ±0.1° |
| Primary Flat Length | 47.5 mm ±2.5 mm |
| Primary Flat Orientation | A-Plane ±0.2° |
| Front Surface Roughness | Ra <0.3 nm |
| Back Surface | Lapped for SSP / Polished for DSP |
| DSP Backside Roughness | Ra <0.3 nm |
| Wafer Edge | R-Type |
| TTV | ≤15 μm |
| Warp | ≤20 μm |
| Laser Mark | N/A |
| Packaging | Cassette with vacuum bag packaging |
6 Inch Sapphire Wafer Overview
The 6 Inch Sapphire Wafer is a 150 mm single-crystal Al₂O₃
substrate available for semiconductor, optical and research applications.
Sapphire provides excellent mechanical strength, chemical stability,
thermal resistance and optical performance.
Material-Semi supplies 150 mm sapphire wafers with standard and customized
crystal orientations, wafer thicknesses and surface finishes.
C-plane sapphire is one of the standard options, while A-plane, M-plane
and other orientations can be supplied according to project requirements.
C-Plane, A-Plane and M-Plane Sapphire Wafers
Crystal orientation can be selected according to the intended application.
Available options include C-plane, A-plane, M-plane
and customized orientations.
On-axis and custom off-axis sapphire wafers are also available.
Customers can specify the required off-axis angle and direction when requesting
a quotation.
SSP and DSP Sapphire Wafers
Both single-side polished (SSP) and
double-side polished (DSP) sapphire wafers are available.
For SSP wafers, the front surface can be provided with high-quality polishing
while the backside can be lapped or ground according to the specification.
For DSP wafers, both surfaces can be polished to achieve high surface quality.
Epi-ready surface finishing is also available for applications requiring
high-quality polished sapphire substrates.
Custom Sapphire Wafer Options
In addition to standard 150 mm specifications, sapphire wafers can be customized
according to different semiconductor, optical and research requirements.
- Custom wafer diameter and dimensions
- Custom wafer thickness
- C-plane, A-plane, M-plane and other crystal orientations
- On-axis and custom off-axis angles
- Single-side polished (SSP) or double-side polished (DSP)
- Epi-ready surface finishing
- Custom flat or notch orientation
- Custom edge profile and bevel
- Custom surface roughness and dimensional tolerances
- Custom packaging requirements
Please provide the required diameter, orientation, thickness,
surface finish, off-axis angle, quantity and other technical requirements
for evaluation and quotation.
Surface Quality and Wafer Geometry
Surface roughness, TTV, bow and warp can be controlled according to the
selected wafer specification. For the typical 150 mm C-plane specification,
front-side surface roughness can reach Ra <0.3 nm,
with TTV ≤15 μm and Warp ≤20 μm.
How Sapphire Wafers Are Manufactured
Sapphire wafer manufacturing generally includes single-crystal growth,
crystal orientation, slicing, grinding, lapping, polishing, cleaning
and final inspection.
These processes are used to control wafer dimensions, crystal orientation,
surface roughness, flatness and edge quality before final packaging.
Packaging
6 inch sapphire wafers can be supplied in wafer cassettes,
single wafer containers or customized packaging according to order quantity
and transportation requirements.
Frequently Asked Questions
What is a 6 Inch Sapphire Wafer?
It is a single-crystal Al₂O₃ substrate with a nominal diameter of 150 mm.
What crystal orientations are available?
C-plane, A-plane, M-plane and customized crystal orientations are available.
Custom off-axis specifications can also be supplied.
Are SSP and DSP sapphire wafers available?
Yes. Both single-side polished (SSP) and double-side polished (DSP)
sapphire wafers are available.
Can the wafer thickness be customized?
Yes. Standard and custom thickness specifications are available according
to customer requirements.
Is epi-ready polishing available?
Yes. Epi-ready polished sapphire surfaces can be supplied for applications
requiring high surface quality.
Can you provide custom wafer dimensions?
Yes. Custom diameter, thickness and dimensional specifications can be
evaluated according to the required application and quantity.
